Hong Kong Mould and Summit will be organised on 6 Dec 2023 which is the flagship event of HKMDC this year aiming to foster regional co-operation opportunities for all local industrial practitioners as well as Mainland/overseas industry players to gain first-hand market information from the regional representatives, and exchange on the latest trends of the industry. It also aims to provide a communication platform for the global mould and die industries, for exchanging business information among members, enhancing regional collaborations, seeking opportunities to promote win-win technical cooperation for the mould and die industry and upgrading their capabilities. Through the mini showcase, participants can experience and be inspired by the technical strengths of the Hong Kong mould and die industry.
Event |
Hong Kong Mould and Die Summit – Empowering the Industry with Innovation Transformation |
Date |
6 December 2023 (Wednesday) |
Time |
10:00 – 17:30 |
Venue |
Charles K. Kao Auditorium, Hong Kong Science Park |
Language |
English (SI with Cantonese & Putonghua) |
Fee |
Free |
Format |
Physical & Online Live-streaming |
Click here for the pamphlet
Click here for rundown
Click here for Presentation material
Click here for photos
Click here for highlight video:
Click here for recording video (AM):
Click here for recording video (PM):
Any opinions, findings, conclusions or recommendations expressed in this material/event (or by members of the project team) do not reflect the views of the Government of the Hong Kong Special Administrative Region or the Vetting Committee of the Trade and Industrial Organisation Support Fund.
Organiser | Funded by Trade and Industrial Organisation Support Fund, Trade and Industry Department | |||||
Any opinions, findings, conclusions or recommendations expressed in this material/event (or by members of the project team) do not reflect the views of the Government of the Hong Kong Special Administrative Region or the Vetting Committee of the Trade and Industrial Organisation Support Fund.