2023

TSF Project: "To enhance the competitiveness of Hong Kong mould and die industry through exchange of market information and collaboration with industry players in Asia"

 

With the funding support from Trade and Industrial Organisation Support Fund ("TSF") of the Trade and Industry Department of the Government of the Hong Kong Special Administrative Region ("HKSAR"), a series of events were organised by Federation of Hong Kong Industries ("FHKI") and Hong Kong Mould and Die Council ("HKMDC").


The project aimed to enhance the collaboration between Hong Kong mould and die enterprises and Asian mould and die enterprises, facilitate Hong Kong enterprises to grasp the latest market information of other Asian markets and showcase technical capabilities of Hong Kong mould and die industry to other Asian industry players.  We hoped to get the most updated market information from different Asia regions and seek collaboration opportunities with other Asian precision mould and die associations.

  • Hong Kong Mould and Die Summit – Empowering the Industry with Innovation Transformation

    Date     : 2023-12-06

  • Mini Showcase

    Date     : 2023-12-06

  • Hong Kong Local Study Mission

    Date     : 2023-12-07

Organiser     Funded by Trade and Industrial Organisation Support Fund, Trade and Industry Department   Implementation Agent

     

 

Any opinions, findings, conclusions or recommendations expressed in this material/event (or by members of the project team) do not reflect the views of the Government of the Hong Kong Special Administrative Region or the Vetting Committee of the Trade and Industrial Organisation Support Fund.

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